厚铜板线路制作工艺探讨

Discuss about the line production process of thick copper

在厚铜板件的生产制作过程中,蚀刻一直是一个难点。为了达到蚀刻目的,制作上一般选择多次快速蚀刻或者一次性慢速蚀刻。本文通过对比不同面铜厚度的板进行蚀刻,分析比较不同蚀刻方式对蚀刻因子、线宽和线形的影响,并对其差异性进行原因分析。为生产和设计提供有价值的参考。

In thick Copper PCB production,the etching has been a difficulty.To achieve the purpose of etching,producing generally choose multiple rapid etching or etching off slow.This paper compares different thickness of the plate surface of copper etching,analyzes and compares the difference of etching on the etching factor,line width,line shape,and analyzes the reason of their differences.It is a valuable reference for the production and design of PCB.