超厚铜(343μm)PCB的制作工艺探讨

Discussion about the production process of the PCB with extra-thick copper(343μm)

随着电子技术的不断发展,PCB上集成的功能元件数越来越多,对线路的电流导通能力和承载能力的要求越来越高,线路板的铜厚会越来越厚,而能够提供大电流和将电源集成的超厚铜(343μm及以上)印制电路板将逐渐成为今后线路板行业发展的一个趋势,在未来的电子领域中前景广阔。本文主要针对343μm超厚铜箔PCB的制作工艺进行研究,采用逐层叠加的方法,以铜厚137.2μm的底铜板料制成了成品铜厚达到μm的印制电路板,文章分析和讨论了几种制作工艺的可行性,同时对影响超厚铜箔印制板质量的关键工艺控制点进行了研究,通过改进和优化,进而找出了理想的工艺路线和工艺条件。

With the development of electronic technology,more and more functional elements integrate on the printed circuit board,and the conduction capability and carrying capacity have become increasingly demanding,then,the copper thickness will become increasingly thick,so,the PCB with extra-thick copper foil(343μm and above) which is able to provide high current and integrate power supply will gradually become a trend in the future of the circuit board industry and has a broad market prospect.The article studied the manufacturing process of the PCB with 10OZ copper foil,and with the addition method,the PCB with 343 μm copper foil was manufactured successfully with the 4OZ copper clad laminate.What' s more,the article analyzed and discussed the feasibility of several production processes,and studied the critical control point affecting it' s quality,then,through improving and optimizing,we have identified the ideal process routes and process conditions.