铜箔与基材间的应力作用研究

Studies on stress effect between copper and base material

覆铜板是由玻璃纤维布、树脂、铜箔三种不同的材料组成,在加工过程PCB会发生变形,由于铜箔和基材之间的物性差异,变形过程中产生的应力作用对粘结强度、涨缩、翘曲有着重要的影响,文章对蚀刻和烘板过程中铜箔与基材间的应力作用进行了研究,根据复合材料力学理论,建立了应力的数学关系式,可以直观、定量地描述材料的变形和应力作用。

CCL is composed of different materials.In the process,PCB will deform because of differences in material properties,and stress will generate,which have a major impact on bond strength,expansion and shrinkage,warpage,stress action between copper and base material in DES and baking were studied in the article,according to composite material mechanics theory,the mathematical relationship about stress was established,so as to describe intuitively and quantitatively deformation and stress of PCB.