摘要
在多层板制造过程中,内层芯板的收缩极大地影响了产品的质量。本文通过对多层板制作过程中的尺寸变形的分析,指出导致内层芯板变形的主要因素为材料热胀系数不匹配。通过对半固化片状态变化过程的分析,建立了层压过程各个阶段的数学模型。通过解析计算,得到结构为铜面/半固化片/铜面的一种高Tg芯板纬向菲林补偿系数为1.24668,与实际实验中得到的补偿系数比较接近。
The laminated sheets' shrink during the lamination process affects the quality of the electronic products.According to the analysis of the lamination process,it was found that the main factor of the laminated sheets' shrink is the mismatch of Coefficient of Thermal Expansion(CTE).Considering the stage change of the prepreg(PP),the mathematical model of each stage in lamination is established,ignoring the different graphics in each layer of copper foil.After calculate we get the film compensating factor,which is close to the practical situation.
出处
《印制电路信息》
2010年第S1期366-373,共8页
Printed Circuit Information
关键词
多层板
层压
热胀系数
半固化片
补偿系数
multi-layer board(MLB)
lamination
CTE
PP
the film compensating factor
