背钻孔内披锋改善分析研究

Study and improvement on burrs in backdrilling hole

背钻技术在高频电路板上运用越来越广泛,但背钻技术在加工过程中出现孔内披锋频繁,严重影响产品信号传输,在下游的SMT厂家焊接过程中,容易出现焊接不牢、虚焊、短路等问题。文章主要针对背钻加工出现孔内披锋的研究,通过实验分析找出背钻孔内披锋产生的原因,并且有针对性的对加工参数、钻头选择等方面对背钻孔内披锋改善的影响度研究;发现加工参数和钻头选择为孔内披锋产生的重要原因,通过实验优化背钻加工工艺参数,能够明显改善背钻孔内披锋。

Back drilling technology apply more widely on high frequency PCB.During back drilling process the burrs in hole often occur and impact the transition ofinformation.Some problems,such as weak soldering or shorts,will happen when the PCB with burrs in the back drill hole get soldering.The article study on the burrs in the back drill hole and seek for the cause ofit.Then the experiments are designed to study the influence of manufacturing parameters,selection of drill bit,and find out they are important reason of burrs in the back drilling hole.So the back drilling process parameters are optimized and great improvements have achieved.