摘要
随着线路板不断向高密度化方向发展,客户设计散热过孔的孔壁间距也随之减少,密集散热孔在热应力测试后出现分层的风险也相应加大。为了降低此类风险,我们测试并分析了不同板材、不同孔壁间距对分层的影响,为生产和设计提供了有价值的参考。
As PCB is developing higher and higher densely,the distance between thermal via designed by customers is much less than before.When the thermal via comes more close,the risk of delamination of PCB becomes higher after thermal stress.In order to decrease this kind of risk,we tested and analyzed the infiuence of delamination with different kinds of material and different thermal via distance.This article offers valuable reference for manufacture and design.
出处
《印制电路信息》
2010年第S1期551-560,共10页
Printed Circuit Information
关键词
板材
密集散热孔
热应力
分层
Base material
High density thermal via
Thermal stress
Delamination
