多芯片组件中金丝金带键合互连的特性比较

Comparison of Characteristics of Wire and Ribbon Bonding Interconnects in MCM

金丝、金带键合已经广泛应用于毫米波多芯片组件的互连之中。本文讨论了在20-40GHz频率范围内,单根、两根、三根金丝和金带连接的性能。测试结果表明两根和三根金丝连接的性能优于金带连接的性能,金带连接的性能优于单金丝连接的性能。

Wire and Ribbon bonding have been widely used for interconnect of millimeter-wave multi-chip module(MCM).In this paper,characterizations of single,double,triple bondwires and ribbon bonding are discussed in a frequency range from 20 to 40 GHz.The measured results show that the double and triple bondwires are prior to ribbon bonding and ribbon bonding are prior to single bondwire in terms of microwave characterizations.