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基于SPECCTRAQuest多板互连信号仿真与分析 被引量:1

Multi-Board Interlink Signal Simulation and Analysis Based on SPECCTRAQuest
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摘要 随着设计复杂度的增加及板级系统的不断减小,多板协同工作成为趋势。该文阐述了利用EBD模型所建立的多板仿真系统,该系统通过分析提取信号的Reflection仿真信息,改善信号的拓扑结构,设置电气约束,指导PCB布局布线,为原理图修改提供支持。 With the increase of complexity of design and the constant reduction of on size of board-level systems, cooperative operation of multi-board becomes a trend. This paper discusses how to utilize EDB model to build multi-board simulation system, improve the signal Topology, set up Electrical constraints, and give guidance for routing and layout of PCB.
出处 《电子科技大学学报》 EI CAS CSCD 北大核心 2010年第S1期67-70,共4页 Journal of University of Electronic Science and Technology of China
基金 国家863计划(2009AA01Z310) 中加政府间科技合作基金(2009DFA12100)
关键词 EBD模型 IBIS 多板仿真 反射 EBD model IBIS multi-board simulation reflection
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参考文献7

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二级参考文献7

  • 1曹跃胜.IBIS模型与高速PCB设计分析[C]..第8届计算机工程与工艺全国学术年会论文集[C].昆明,2003.67-71.
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