4Bardi F,,Cabibbo M,Evangelista E.An analysis ofhot deformation of an Al-Cu-Mg alloy produced by powder metallurgy. Materials Science andEngineering . 2003
5Hsieh C C,Yao S C.Evaporative heat transfercharacteristics of a water spray on micro-structuredsilicon surfaces. International Journal of Heat andMass Transfer . 2006
6Upadhya G,Zhou P.Electro-kinetic micro-channelcooling system for servers. Proceedings ofITHERM 2004 . 2004
7Upadhya G,Munch M,Zhou P,et al.Micro-scaleliquid cooling system for high heat flux processorcooling applications. 22 nd IEEE Semi-ThermSymposium . 2006
6G. I. Sultan. Enhancing forced convection heat transfer from multiple protruding heat sources simulating electronic components in a horizontal channel by passive cooling. Microelectronics Jounal, 2000,31 : 773 - 779.
7Y. Oule-Amer, S. Chikh,K. Bouhadef. Forced convection cooling enhancement by use of porous materials. Int. J. Heat Mass Transfer, 1998,19 : 251 -- 258.
8Mingoo Choi, Keumnam Cho. Liquid cooling for a multi - chip module. Int. J. Heat Mass Transfer, 2000,43 : 209 -- 218.
9Charlotte Gillot,Alain Bricard. Single and two - phase heat exchangers for power electronic components. Int. J. Therm. Sci,2000,39:826--832.
10Wu - Shung Fu, Suh - Jenq Yang. A new model for heat transfer of fins swinging back and forth in a flow. Int. J. Heat Mass Transfer,2001,44: 1687--1697.
