单晶硅超精密切削表面质量各向异性的研究

Research on Orientation dependence of Surface Quality Involved in Ultra-Precision Turning of Single Crystal Silicon

分析了单晶硅超精密切削时被加工晶面和滑移面间的相对关系以及单晶硅的力学特性,基于单晶硅超精密切削加工脆塑转变机理,模拟了分别以单晶硅(111)(、110)(、100)晶面为被加工面时的表面质量的各向异性特性。模拟结果表明这些晶面在不同晶向方向上表面质量呈现明显的各向异性特性,而以单晶硅(111)晶面作为被加工面时可以得到最好的加工表面质量。

The crystallographic relations of machined crystal plane and slip plane involved in ultra-precision turning and the mechanics characteristic of single crystal silicon are studied.Based on the brittle-ductile transition mechanism of ultra-precision turning of single crystal silicon,orientation dependence of surface quality of silicon which machined respectively along the(111),(110) and(100) crystal plane are investigated by using computer simulation and turning experiment.According to the simulation results,surface quality of all these machined crystal planes have obviously showed crystallographic orientation dependence and(111) crystal plane has best machinability than others.