摘要
The thin wafer(such as BOC) is often cracked easily after Die-Attach process and large numbers of products in some semiconductor company failed as a result of crack.So it is urgent to get the solution to assure the quality and increase the yield.This article explained the relation of crack,the chip strength,as well as Die-Attach pin-up speed and how to solve that issue.For example,additional polishing process can significantly decrease the grind mark damage;pin-up speed optimization can make pin-up force best.So linear crack of thin chip can be avoided effectively.
The thin wafer(such as BOC) is often cracked easily after Die-Attach process and large numbers of products in some semiconductor company failed as a result of crack.So it is urgent to get the solution to assure the quality and increase the yield.This article explained the relation of crack,the chip strength,as well as Die-Attach pin-up speed and how to solve that issue.For example,additional polishing process can significantly decrease the grind mark damage;pin-up speed optimization can make pin-up force best.So linear crack of thin chip can be avoided effectively.
出处
《上海交通大学学报》
EI
CAS
CSCD
北大核心
2007年第S2期45-47,共3页
Journal of Shanghai Jiaotong University
