混合型多层基板的电磁兼容性研究

Electro Magnetic Compatibility(EMC) Research on Mixed-Multilayer Substrate

混合型多芯片组件(MCM-C/D)是一种高级类型的多芯片组件,它具有非常好的电气性能.随着集成电路逐渐朝小型化、高密度、高速度方向发展,随之产生的互连线间的电磁干扰和信号延迟问题日趋严重,很大程度上制约了多芯片组件的快速发展.通过建立MCM-C/D的封装模型,依靠CST微波仿真软件来研究信号线间的电磁干扰,通过分析仿真结果来优化基板的布局和电路走线.

Mixed multi-chip module(MCM-C/D) is a senior type of MCM,which has very good electrical performance.Integrated circuits develop gradually in the direction of miniaturization,high-density and high-speed,the result of which is that the electromagnetic interference and signal interconnect delay is becoming a serious problem,largely restricting the rapid development of multi-chip module.This paper set up an MCM-C/D packaging model,by a microwave simulation software named CST to study the electromagnetic interference between the signal lines.Through the analysis and simulation,the layout of the circuit and substrate alignment can be optimized.