SnAgCu焊料的粘塑性及空洞损伤行为分析

The Viscoplasticity and Void Damage Behaviors of SnAgCu Solder Alloy

开发新的基于数字散斑相关方法(DSCM)的摄像机控制拉伸实验方法,在温度25-150°C和应变率10-5-10-3s-1范围内进行一系列的恒应变率拉伸实验,得到真应力-真应变关系和空洞演化规律.以此研究95.5Sn4.0Ag0.5Cu无铅焊料在不同加载条件下的粘塑性-损伤行为,揭示空洞成核和生长变形机理的存在和影响,为材料参数的获得和粘塑性-损伤本构模型的建立奠定实验基础.

Based on digital speckle correlation method(DSCM),a novel video control experimental technique was developed for assessing tensile experiments.A series of tensile experiments on SnAgCu solder alloy was conducted under various constant true strain rates ranging from 10^(-5) to 10^(-3) s^(-1) and at 25℃ to 150℃.And the true stress-true strain relations and void damage evaluation law were achieved.Based on the experimental results the viscoplastic-damage behavior of the material was investigated at different load.The results reveal the presence of both the nucleation and growth deformation mechanisms of void,which can lay a foundation for getting the material parameters and setting up viscoplastic-damage constitutive model.