提高大面积敷铜箔板再流焊接质量的研究

Study on Improving the Joint Quality of Reflow Soldering for Large Dimension Copper-Clad Laminates

通过陈述大面积敷铜箔板的焊接特点,指出采用SMT工艺组装大面积敷铜箔板的难点;详细阐述了采用DFM原则提高设计质量、严格控制印膏质量和合理设置再流焊接温度曲线3个方面的试验过程.试验验证了通过提高产品设计质量、模板制作质量和合理设置再流焊接温度曲线等措施,能大大提高双面大面积敷铜箔板的再流焊接质量.

This paper stated the characteristic of soldering for large dimension copper-clad laminates,and pointed out the difficulties of adopting SMT techniques to assemble it.Then it expatiated how to use DFM principle to enhance the design quality,control the quality of solder paste strictly and set the temperature curve of reflow soldering reasonably.Finally,it was summarized that some measures proved by experiments,such as improving the quality of product design,stencil facture and reasonably setting the temperature curve of reflow soldering, could increase the quality of reflow soldering for large dimension copper-clad laminates a lot.