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基于印制电路板板级的可制造性设计分析 被引量:3

The Design for Manufacture Analysis Based on Printed Circuit Board
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摘要 从可制造性设计(DFM)的定义和trilogy 5000软件开始,说明了印制电路板(PCB)板级DFM的必要性.简述了PCB板上元器件的选型所遵循的标准和Mark点的设立原则.详细叙述了焊盘的设计尺寸、PCB板层的设计规则、PCB设计的布局规范、PCB布线规范等几个PCB设计所涉及到的方面.另外,介绍了几种常见的SMT物理封装形式和元器件与定位孔的间距以及线与焊盘、线与过孔、过孔与焊盘的最小间距. In view of the definition of design for manufacture(DFM) and the valor software trilogy 5000 this paper explained the necessity of the DFM of printed circuit board(PCB).The standard of choosing components which will be on the PCB and the principle with which Mark following is set up were simply introduced.The size of pad and the principle of setting up PCB layer and the rules of the layout design and the track,as setting up PCB following with,were described.The footprint of familiar SMT,the space between the components and the local hole,and the minimum distance between the track and pad,as well as the track and via,the via and the pad were also introduced.
出处 《上海交通大学学报》 EI CAS CSCD 北大核心 2007年第S2期91-94,共4页 Journal of Shanghai Jiaotong University
关键词 印制电路板 可制造性设计 分析 printed circuit board(PCB) design for manufacture(DFM) analysis
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参考文献2

  • 1贾变芬,沈钢.DFM软件在PCB设计中的应用[J].电子工艺技术,2004,25(2):71-73. 被引量:4
  • 2S. Krishnan,K. Srihari. A knowledge-based object oriented DFM advisor for surface mount PCB assembly[J] 1995,The International Journal of Advanced Manufacturing Technology(5):317~329

二级参考文献3

  • 1.IPC—SM-782A 1993.表面贴装元件及焊盘设计[S].,..
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  • 3G布斯劳.面向制造与装配的产品设计[M].北京:机械工业出版社,1999..

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