Eupec公司的IGBT^3芯片及其对应的1200V功率模块

The 3rd Generation of IGBT Chip & 1200V IGBT Modules of Eupec

本文首先介绍了Eupec公司的IGBT^3芯片结构和技术特点。通过与标准的IGBT芯片进行性能比较,阐明了IGBT^3芯片具有更低的开关损耗和通态损耗、更高的电气强度,可以进一步提高整机的转换效率和功率密度。最后介绍了基于IGBT^3芯片新的EconoPACK+封装模块。

The structure & technology characteristic of Eupec s IGBT^3 chip and the novel EconoPACK + modules adopting such chips are introduced in this article. Compared with standard IGBT chip, the advantages of IGBT^3 chip, such as lower switching loss, on state loss, higher electric ruggedness are presented. With such IGBT chip, the higher efficiency and power density could be attained.