摘要
The interaction between Cu and liquid Sn was studied by microstructure observation.The curve of the dipping time with related to dissolving and diffusion of Cu in liquid Sn is given. The Cu dissolves rapidly in liquid Sn at the beginning,then an intermetallic compound Cu_6Sn_5 forms,and the dissolving follows to slow down.At temperature up to 350℃,the hard feather-like Cu_6Sn_5 is sharply growing up and speads through the dipped Sn laver.The way to inhibit the growth of the intermetallic compound Cu_6Sn_5 was also approached.Thus,on the above mentioned basis,the physical meaning of the wetting curve traced by the meniscograph wettability tester has been derived as film detaching,Cu dissolying and Cu_6Sn_5 growing.
The interaction between Cu and liquid Sn was studied by microstructure observation.The curve of the dipping time with related to dissolving and diffusion of Cu in liquid Sn is given. The Cu dissolves rapidly in liquid Sn at the beginning,then an intermetallic compound Cu_6Sn_5 forms,and the dissolving follows to slow down.At temperature up to 350℃,the hard feather-like Cu_6Sn_5 is sharply growing up and speads through the dipped Sn laver.The way to inhibit the growth of the intermetallic compound Cu_6Sn_5 was also approached.Thus,on the above mentioned basis,the physical meaning of the wetting curve traced by the meniscograph wettability tester has been derived as film detaching,Cu dissolying and Cu_6Sn_5 growing.
