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SOLID REACTION BETWEEN PRESSLESS SINTERED Si_3N_4 SUBSTRATE AND Ti-DEPOSITED FILM

SOLID REACTION BETWEEN PRESSLESS SINTERED Si_3N_4 SUBSTRATE AND Ti-DEPOSITED FILM
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摘要 The chemical reaction at solid state between the pressless sintered Si_3N_4 substrate and Ti-de- posited film has been studied by X-ray diffraction analysis.The reaction all depends upon the temperature.It seems no reaction below 973 K:Ti_2N and Ti_5Si_3 form from 1073 to 1123 K: TiN and Ti_5Si_3 form at 1173 K,TiN and Ti_5Si_4 form at 1273 K;while the titanium film di- minishes completely.The lattice parameter of Si_3N_4 is unchanging thrioughout postannealing. This implies that the Ti atoms never dissolve into the Si_2N_4 lattice. The chemical reaction at solid state between the pressless sintered Si_3N_4 substrate and Ti-de- posited film has been studied by X-ray diffraction analysis.The reaction all depends upon the temperature.It seems no reaction below 973 K:Ti_2N and Ti_5Si_3 form from 1073 to 1123 K: TiN and Ti_5Si_3 form at 1173 K,TiN and Ti_5Si_4 form at 1273 K;while the titanium film di- minishes completely.The lattice parameter of Si_3N_4 is unchanging thrioughout postannealing. This implies that the Ti atoms never dissolve into the Si_2N_4 lattice.
出处 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 1990年第9期207-210,共4页 金属学报(英文版)
关键词 TITANIUM silicon nitride INTERFACE solid reaction titanium silicon nitride interface solid reaction
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