摘要
锡基焊料是电子工业上广为使用的连接材料,随着环保意识的增强,人们加强了对无铅焊料的研究。文章概述了锡基无铅电子焊料的发展概况,主要介绍了Sn-Ag、Sn-Zn、Sn-Cu和Sn-Bi四种合金系焊料的最新研究进展,指出了锡基无铅焊料的应用和发展趋势。
Tin-based solder is used extensively in electronics industry. The study on lead free solder is intensified due to the more strict requirement on environmental protection. In this review, the recent research and development of tin based lead-free electronic solder were summarized, mainly including Sn-Ag,Sn-Zn, Sn-Cu and Sn Bi based solders. The applications and prospect of tin based lead free electronic solder were also proposed.
出处
《金属功能材料》
CAS
2009年第2期55-59,共5页
Metallic Functional Materials
基金
安徽省2008年科技攻关计划重大科技专项项目(080102020)
