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Mark Ⅱ型机加工陶瓷与Vita VM9饰面瓷结合界面的研究 被引量:6

Interface bond and compatibility between Mark Ⅱ machining ceramic and Vita VM9 veneering porcelain
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摘要 目的研究Mark Ⅱ型机加工陶瓷基底层与Vita VM9饰面瓷之间的界面结合情况及匹配性。方法制作30mm×15mm×1mmMark Ⅱ瓷块样本1个,在底面中份预制0.5mm深的刻痕与样本长轴垂直,表面涂布烧结0.3mm厚的VM9不透明牙本质瓷。将样本从刻痕部位折断,在扫描电镜下观察结合界面的形貌和构象,采用电子探针对基底瓷、饰面瓷内部及结合界面进行元素定量分析,观测元素质量分数的变化。另外制作Mark Ⅱ瓷块样本10个,做热冲击试验,计算平均耐热冲击温度。结果扫描电镜观察显示2种材料在界面区镶嵌融合,结合紧密无间隙。电子探针分析表明界面区Al和Ca元素质量分数呈梯度变化,由基底瓷向饰面瓷Al的质量分数下降,Ca则上升;提示基底瓷中Al和饰面瓷中Ca有越过界面相互渗透的现象。10个样本的平均耐热冲击温度为(194.0±10.3)℃,裂纹均出现于饰面瓷。结论Mark Ⅱ型机加工陶瓷基底层与VM9饰面瓷之间有良好的结合性及热匹配性。 Objective To investigate the interface bond and thermal compatibility between Mark Ⅱ machining ceramic and Vita VM9 veneering porcelain. Methods A bar shaped specimen (30 mm×15 mm×1 mm in size) of Mark Ⅱ block was prepared, with 0.5 mm-teep notch (vertical to the long axis of specimen) at the middle of the bottom surface. The upper surface was veneered with 0.3 mm VM9 dentin base porcelain. Then the specimen was fractured from the notching site and the fracture surface was examined under scanning electron microscope (SEM) and electron microprobe analyzer(EMPA) with electron beam of 1 μm in diameter. Another ten specimens (30 mm×15 mm×1.5 mm in size) were fabricated and the temperature of thermal shock resistance were tested. Results SEM observation showed tight bond between these two materials and EMPA results showed penetration of Al element from Mark Ⅱ block into veneering porcelain and Ca element from veneering porcelain into Mark Ⅱ block occurred after sintering baking. The average temperature of thermal shock resistance for specimens in this study was (194.0±10.3) ℃. Cracks were mainly distributed in veneering porcelain. Conclusion Chemical bond exists between the Mark Ⅱ machining ceramic and Vita VM9 veneering porcelain, and there is good thermal compatibility between them.
出处 《华西口腔医学杂志》 CAS CSCD 北大核心 2009年第2期154-156,共3页 West China Journal of Stomatology
基金 大连市卫生局科技自主创新及普及推广基金资助项目(2005KG0005)
关键词 牙科陶瓷 电子探针 匹配性 dental ceramic electron microprobe analyzer compatibility
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