电子封装钎料合金耦合损伤的多轴时相关低周疲劳失效研究

Damage-coupled Multiaxial Time-dependent Low Cycle Fatigue Failure for Electronic Packaging Solder Alloy

基于63Sn-37Pb钎料合金材料的多轴时相关循环变形行为及疲劳失效行为,提出了耦合损伤的多轴时相关理论模型及疲劳失效模型,模型引入了损伤演化方程,考虑了时相关效应及非比例路径效应,能较好地模拟材料在不同非比例加载路径下的循环变形行为及疲劳失效行为,较准确地预测多轴疲劳寿命。

Based on the multiaxial time-dependent cyclic deformation and fatigue failure behavior of 63Sn-37Pb solder alloy,the damage-coupled multiaxial time-dependent constitutive model and fatigue failure model were proposed,where the evolution equation of damage was introduced and the time-dependent effect and nonproportional path effect was taken into account.The model can satisfactorily simulate the cyclic deformation and fatigue failure behavior following different nonproportional loading paths,and the model also can predict the multiaxial fatigue life well.