摘要
微电子行业是当今世界公认的高技术产业。为其配套的高分子材料同样要具备相应的高性能、高纯度，是合成材料中的高技术含量产品。用于微电子高集成度产品粘合、密封保护、涂膜的高品质环氧树脂和酚醛树脂即是当前发展最快的高分子品种之一。
Microelectronic field was known as full of high technlque- The polymer materials used in this field should be with high property,high purity and be the products with high technique content. The high pure epoxy and novolak resins used in adhesion,sealing and coating of mi-croeletronic integrated circuit have been developed rapidly.
出处
《热固性树脂》
CAS
CSCD
1998年第1期58-60,共3页
Thermosetting Resin
