氧化锆流延基片的烧结温度及其性能研究

Sintering temperature and properties of ZrO_2 tape-casting substrate

比较了3种不同的烧结温度对氧化锆流延基片性能的影响。结果表明,随着烧结温度的升高,基片的收缩率和相对密度增加、硬度增加、气孔率减小、晶粒和气孔的平均尺寸均有所增加。在1 500℃保温3 h可以获得较高的致密度(相对密度97.8%)和合适的晶粒尺寸,试样在1 073 K时离子电导率为1.187×10-2S.cm-1,烧结体物相主要为四方相。

The effects of three different sintering temperatures on the ZrO2 tape-casting substrate are compared. The results show that, as the sintering temperature increases, the shrinkage ratio, relative density,rigidity,and average sizes of pore and grain of the substrate also increase while the porosity decreases . Suitable density and grain size are obtained when the samples are sintered for 3 hours at 1 500 ℃ ,the ionic conductivity of the samples is 1. 187×10^-2S·cm^-1 at 1 073 K, and the main phase of the samples is tetragonal zirconia.