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Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder 被引量：4

Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder
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摘要 Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ CusZn8 particles are formed and distributed uniformly in the composite solders. The strength and plasticity of the composite solders were improved, and creep resistance was considerably enhanced. The wettability of these composite solders is also better than that of Sn-9Zn. Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ CusZn8 particles are formed and distributed uniformly in the composite solders. The strength and plasticity of the composite solders were improved, and creep resistance was considerably enhanced. The wettability of these composite solders is also better than that of Sn-9Zn.
作者 黄惠珍
机构地区 School of Materials Science and Engineering
出处 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2009年第2期206-209,共4页 武汉理工大学学报（材料科学英文版）
基金 Funded by the Major Scientific and Technical Project Program of Jiangxi Province (No.2005008) the Science & Technology Project of Education Department of Jiangxi Province (No.[2007]53 and No.GJJ09416)
关键词 lead-free solder Sn-Zn alloy Cu powders composite solder WETTABILITY lead-free solder Sn-Zn alloy Cu powders composite solder wettability
分类号 TB33 [一般工业技术—材料科学与工程]
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参考文献1

二级参考文献8

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共引文献8

同被引文献53

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引证文献4

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Journal of Wuhan University of Technology(Materials Science)
2009年 第2期

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