摘要
脉冲偏压电弧离子镀的成膜过程远离热力学平衡态，与直流偏压电弧离子镀相比，具有成膜温度低、薄膜质量好和应力低等优点。从大颗粒净化作用、低温沉积、沉积速率、微观组织结构、内应力与结合强度、硬度等方面，综述了近年来脉冲偏压对薄膜性能影响的研究结果，重点讨论了机理方面的新成果，综述了脉冲偏压电源的研究状况，并对脉冲偏压电弧离子镀技术的应用前景进行了展望。
The process of Plused Bias Arc Ion Plating （PBAIP） is far away from thermodynamic equilibrium state and has the advantages of higher interface bonding strength, lower substrate temperature, and lower residual stress etc. than conventional DC bias Arc Ion Plating （AIP）. The basic features of the effect of PBAIP on the performance of coating are discussed and the application prospect of pulsed bias arc ion plating power supply is explored at the same time.
出处
《装甲兵工程学院学报》
2009年第2期71-75,共5页
Journal of Academy of Armored Force Engineering
关键词
脉冲偏压
电弧离子镀
热力学平衡态
pulsed bias
arc ion plating
thermodynamic equilibrium state
