摘要
在消费电子和一般工业应用的电机驱动领域智能化模块封装结构研发过程中,设计人员和制造厂商面临如何实施稳健设计,优化工艺流程、提高良率、降低成本、扩大产能等很多实际问题。解决这些问题的首要突破口是智能功率模块结构设计本身,其中模块结构和互连方式设计对产品开发人员的想象力提出极大挑战,而器件应用、可靠性及市场等因素又极大地制约了开发人员创造性的发挥。文章介绍了功率半导体器件及智能功率模块的发展,分析了常用(一般低于1500V)智能功率模块的特点、结构和工艺流程,以及封装过程所使用的材料和产生的问题,最后探讨了封装设计的发展趋势。
In consumer and general industrial filed,the development for Intelligent/Smart Power Module for power and motor control application is facing the big challenge on robust design,Packaging Process Optimization, Yield Improvement,Cost Reduction and Capacity Increment.The solution for these problems are the Package Design itself. While the product application, reliability and marketing factors are becoming the limit to designer＇s imagination.The paper introduced the development status of power semiconductor and Intelligent/Smart Power Module,analyzed the SPM/IPM package structure, character, process flow and materials including the process problems and solutions, finally discussed the trend of package design.
出处
《电子与封装》
2009年第4期4-7,39,共5页
Electronics & Packaging
关键词
功率半导体器件
智能功率模块
封装结构
工艺流程
发展趋势
power semiconductor
intelligent/smart power module
packaging structure
process flow
development trend
