铁氰化铜修饰玻碳电极的制备及电化学性质(英文)

Fabrication and Electrochemical Charactrization of Cupric Hexacyanoferrate Modified Glassy Carbon Electrode

用电化学方法制备了铁氰化铜（ＣｕＨＣＦ）修饰玻碳电极，用循环伏安方法研究了ＣｕＨＣＦ修饰玻碳电极的电化学性质．实验表明ＣｕＨＣＦ在０．４～０．９Ｖ（ｖｓ．ＳＣＥ）电位范围内有一对良好的氧化还原峰，扫描速率为２０ｍＶ／ｓ时，Ｅｐａ＝６７４ｍＶ，Ｅｐｃ＝６５４ｍＶ．扫速增加，式量电位略向正移．考察了支持电解质浓度及平衡离子对ＣｕＨＣＦ修饰玻碳电极电化学性质的影响，支持电解质浓度增加，式量电位正移，峰电位差变小；平衡离子半径增加，式量电位正移．同时对ＣｕＨＣＦ用于电子传递媒体的可能性进行了探讨．

A stabe electroactive thin film of cupric hexacyanoferrate (CuHCF) was electrochemically deposited on the surface of a glassy carbon electrode.The cyclic voltammograms of CuHCF film indicate the presence of a couple of well-defined redox peaks corresponding to the hexacyanoferrate(Ⅱ/Ⅲ)redox couple. The electrochemical properties as a function of the concentration of supporting electrolyte and counterions have been determined primarily from cyclic voltammetric studies,and evidence for electronic conduction through the film has been observed.