基于内聚力模型的微电子封装材料界面失效分析
被引量：1
摘要
界面层裂是微电子封装器件的主要失效模式之一。针对微电子封装器件的界面层裂失效问题，采用内聚力模型的方法，模拟了模塑封装材料和铜引脚层界面在模式Ⅰ、模式Ⅱ以及复合模式（模式Ⅰ和模式Ⅱ）下的裂纹扩展情况，并得到加载力与裂纹开口位移的关系。模拟结果显示，将内聚力模型的方法应用于微电子封装材料的界面层裂失效分析，有助于探索造成可靠性问题的根源，为进一步研究整个器件在生产、制造、测试及使用过程中界面层裂的产生与扩展奠定了基础。
出处
《现代表面贴装资讯》
2009年第2期53-57,共5页
Modern Surface Mounting Technology Information
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