PrimePACK^(TM)封装优化集成模块内的IGBT叠层可提高功率密度

Optimised Integration of PrimePACK^(TM) into Modular IGBT Stacks with Increased Power Density

本文讨论了最新PrimePACK^(TM)模块如何集成到现有的逆变器平台中,描述了包括控制和保护在内的逆变器模块的架构概念。该模块的机械特性允许对热管理进行优化,进而充分发挥IGBT输出电流能力,分析并比较了IGBT驱动的不同方案。最后,给出逆变器的测试结果。

The integration of the new PrimePACK^TM module into an existing inverter platform is discussed. The modular architecture of the inverter concept is described including the control and protection mechanism. The mechanic features of the module allow to optimize the thermal management and to reach a high usability of the IGBTs. Different strategies for IGBT driving are analysed and compared. We finally present first results of inverter performance.