摘要
本文通过在Ｃ／Ｃｕ复合材料的Ｃｕ基体中添加不同的合金元素（Ｓｎ，Ｎｉ，Ｆｅ）获得不同的界面结合强度，研究了界面结合强度对Ｃ／Ｃｕ复合材料热膨胀特性的影响规律，并分析了界面结合强度对降温过程中复合材料的收缩特性及残余应变的影响。
C/Cu composites with different interface bonding strength have been fabricated by adding Sn,Ni or Fe element to the copper matrix. The effect of interface bonding strength on the thermal expansion behavior of C/Cu composites has been investigated. Its influence on the contracting behavior (occurring at the cooling stage) and the residual strain values of composites has also been studied in this paper.
出处
《复合材料学报》
EI
CAS
CSCD
北大核心
1998年第1期83-87,共5页
Acta Materiae Compositae Sinica
关键词
热膨胀性能
碳纤维
铜基复合材料
C/Cu composites, interface bonding strength, thermal expansion behavior, residual strain
