摘要
采用有限元软件,在热循环加载条件下,对四角扁平无引脚封装(QFN,Quad Flat No-lead Package)器件进行了热疲劳可靠性分析。选取PCB焊盘长度等几个因素作为灵敏度分析的输入变量,热疲劳寿命作为输出变量。结果表明:影响QFN器件热疲劳寿命的主要因素依次是焊盘长度、焊盘宽度和焊盘弹性模量等,其灵敏度值分别为:–6.4848×10–1,6.0606×10–1和6.0000×10–1等。提出了提高QFN器件可靠性的方法。
By using the finite element software, the thermal fatigue reliability of QFN （Quad Flat No-lead Package） device was analyzed under thermal cycling loading condition. Some factors such as PCB bonding pad length for example were considered as input variables, and the thermal fatigue life was considered as output variable. Results show that the prominent factors influencing the thermal fatigue life of QFN device are in order of the bonding pad length, the bonding pad width, elastic modulus of the bonding pad, etc., sensitivity values are - 6.484 8×10^-1, 6.060 6×10^-1, 6.000 0×10^-1, etc. respectively. And some means was adduced to enhance QFN reliability.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2009年第5期69-72,共4页
Electronic Components And Materials
基金
预研基金资助项目
