摘要
研制出一台满足集成电路微组装工艺所需的高温烧结炉，介绍该烧结炉的结构组成和设计原理。
A high Temperature bell sintering
furnace has been developed for mi- cropackaging technology in IC fabrication. It's
constitution,construction and de- sign principles are described.
出处
《微细加工技术》
1998年第1期55-62,共8页
Microfabrication Technology
关键词
高温烧结炉
微组装工艺
IC
制造工艺
high tmperature
sintering furnace
mircopackaging technology
