期刊文献+

液态树脂基材料在固态铜基材料上的形貌分析

Morphological analysis of liquid epoxy resin-based materials on copper-based materials substrate
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摘要 采用静滴法观察373~423 K温度范围内液态800环氧树脂基材料在铜基材料上的形貌变化,并分析成分、前期固化或静置处理时间及后期固化温度对液滴形貌的影响。结果表明,随着环氧树脂含量增加,液态树脂基材料在铜基板上的铺展所用时间较长;前期固化后的液滴与铜基材料的接触角较小,达到平衡所需时间较短;环氧树脂含量较高的树脂基材料的固化形貌受前期固化时间的影响较大;提高后期固化温度可促使固化反应快速进行,进而使液滴达到稳定的时间缩短。 The shape change of 800 epoxy resin-based liquid drop on copper-based materials substrate was observed at the temperature of 373-423 K using a sessile drop method. The influences of composition, prophase curing time and anaphase curing temperature on the liquid drop shape were analyzed. The spreading time of epoxy resin-based liquid drop on copper-based materials substmte increases with increasing the content of epoxy resin. Contact angle becomes smaller and the spreading time becomes shorter in the case of the epoxy resin-based liquid material being prophase cured for 24 hours. The shape of cured drop epoxy resin-based material with higher epoxy resin content is influenced more significantly by the prophase curing time. The spreading time becomes shorter with increasing anaphase curing temperature because of the rapid curing reaction.
出处 《粉末冶金材料科学与工程》 EI 2009年第2期127-130,共4页 Materials Science and Engineering of Powder Metallurgy
基金 教育部留学回国人员科研启动基金资助项目(2004-527) 重庆市科委自然科学基金资助项目(CSTC2005BA4016-1) 重庆市人事局留学回国人员资助基金项目(2005-94)
关键词 环氧树脂 铺展 发光二极管(LED) epoxy resin copper spread Light Emitting Diode (LED)
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