化学镀Ni-W-P合金层镀覆工艺的研究

Investigation on the Process of Electroless Plating of Ni-W-P Alloy Deposits

研究了镀液pH值、主盐浓度比（[WO42-]／[Ni2+]）、络合剂及稳定剂浓度对化学镀Ni-W-P合金层W及P含量的影响．结果表明，络合剂对其影响受镀液中主盐钨酸钠含量的控制，欲获得具有高W和P含量的镀层，必须在提高络合剂浓度的同时，按一定比例提高钨酸钠浓度．

The effects from pH value of the bath, ratio of the concentration of main salts ([WO42-]/[Ni2 +]) , the complexing agents and the stabilizers on the content of tungsten and phosphorus in Ni-W-P alloy deposit by electroless plating are studied. The result shows that the effect of the complexing agent is closely related to the concentration of thc Na2WO4. The concentration of the NaWO4 must be increased in proper proportion at the same time when the concentration of the complexing agent is increased in order to obtain an alloy deposit of high tungsten and high phosphorus contents.