摘要
为降低微通道板(MCP)的噪声,提高二代像增强器的产品成品率,该文利用X光电子能谱(XPS)对二代倒像管和近贴管的MCP电极表面进行组份分析。实验发现用氩离子(Ar+)溅射3min后,在近贴管的MCP电极表面检测不到碱金属元素钾(K)、钠(Na),而在倒像管MCP电极表面K的含量为2.16%,Na的含量为5.64%,且在MCP电极表面发现铅(Pb)原子谱峰。实验分析认为,MCP电极表面吸附的碱金属K,Na与从MCP体内偏析于表面的Pb是二代像增强器背景噪声的主要来源之一。
In order to improve the noise properties and the productivity of Gen Ⅱ image intensifier tubes, an XPS analysis on the electrode surface of microchannel plate (MCP) in Gen Ⅱ inverter and wafer is studied. After 3min splash of Ar +, there is nearly no sodium (Na) and potassium (K) on the MCP surface of wafer, but on that of inverter, the concentration of Na is 5.64%, K is 2.16%, and on both MCP surfaces the spectrum of lead (Pb) is found. The researched results show the sorption of alkali metal vapors and the segregation of Pb from MCP interior to the electrode surface are one of important background noise sources of Gen Ⅱ image intensifier tubes.
出处
《南京理工大学学报》
EI
CAS
CSCD
1998年第2期149-152,共4页
Journal of Nanjing University of Science and Technology
基金
国防科技预研行业基金
关键词
像增强器
微通道板
能谱分析
X光电子能谱
image intensifier, microchannel plate, energy spectrum analysis, XPS