聚合物微流控芯片键合微通道变形仿真研究

Simulation Study of Microchannel Distortion of Polymeric Microfluidic Chip with Bonding Technique

微流控芯片在化学分析、临床诊断等领域的前景应用广阔,传统热压成型和键合方法自动化程度低、制作周期长,不能满足芯片高效大批量生产的要求;提出了在模具上压缩芯片的键合方法,并利用有限元软件仿真研究了聚甲基丙烯酸甲酯(PMMA)在不同键合温度和芯片压缩厚度下基片内微通道的变形。结果表明:基片上微通道不能保持键合前的截面尺寸和尺寸精度,通道截面面积变小,在通道高度方向上的变形要远远大于宽度方向上的变形;变形随着温度升高和压缩厚度增加而增大,由热膨胀引起的变形较小,压缩厚度对微通道质量影响要大于键合温度。

Mierofluidie chips were applied in the field of analytical chemistry and clinical diagnostics. A new bonding method was presented because the conditional mierofluidie manufacturing method was unsatisfied with the mierofluidie manufacturing in large quantities for its low automation and long production cycle. Numeric simulation of polymethylmethaerylate （PMMA） microfluidie microehannel distortion was realized by finite element software. The distortion with temperature and compressed thickness were obtained. Results showed that the microehannel in PMMA substrate could not hold the cross-section shape and dimensional accuracy, the area of cross-section decreased, the distortion of mieroehannel in height direction was much more than width direction, The distortion caused by thermal expansion was small, and compressed thickness played more important role in microehannel distortion.