新型等离子体束溅射镀膜机

A newly developed plasma beam sputtering system as coater

本文介绍了新型的等离子体束溅射镀膜机的系统组成、特点、试验结果等内容。该镀膜机将等离子体发生和控制技术应用于溅射镀膜中,克服了磁控溅射的靶材利用率低及难以沉积铁磁性材料的缺点。使用该镀膜机成功地进行了溅射镀膜的试验,试验结果得到了刻蚀均匀性较高的靶材,其靶偏压与靶电流的关系与国外结果相吻合。

Describes the constitution, performance and testing results of a mewly developed plasma beam sputtering system as a coater. With the generation/control technology of plasma applied to the sputtering system, the problems of low utilization ratio of target material in magnetron sputterintg and difficult deposition of ferromagnetic materials were solved. The films were successfully deposited with the sputtering system, and testing results showed their high etching homogeniety. The relationship between bias voltage and current of target was revealed in line with foreign earlier works.