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马来酰亚胺封端的叔丁基侧基聚酰亚胺合成和应用研究 被引量:1

Synthesis and Applied Research on Maleimide-Terminated Oligomers Derived from 1,4-bis(4-aminophenoxy)-2-t-butylbenzene
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摘要 用自制的叔丁基二胺单体1,4-双(4-氨基苯氧基)-2-叔丁基苯(BATB)与三种二酐3,3',4,4'-二苯醚四酸二酐(ODPA)、3,3',4,4'-二苯甲酮四酸二酐(BTDA)、2,2'-双[4-(3,4-二羧苯氧基)苯基]丙烷四酸二酐(BPADA)反应,以马来酸酐作为封端剂得到了一系列链中含酰亚胺环的内扩链双马来酰亚胺,齐聚物的相对分子质量控制为4000~10000。将所得的溶解性好的双马来酰亚胺固体粉末溶于极性溶剂后,直接涂覆铜箔形成20μm涂层,干燥,再经程序升温固化,可以得无胶型挠性覆铜板,具有优异的耐热性、尺寸稳定性及低的吸水性。 A series of maleimide-terminated polyimide oligomers from imidized 1,4-bis (4-aminophenoxy)-2-t-butylbenzene and 3,3",4,4"- oxydiphthalic anhydride (3,3",4,4"-ODPA) or 3,3",4,4"-benzophenone tetracarboxylic dianhydride (3,3",4,4"-BTDA) or 2,2'-bis [4-(3,4- dicarboxyphenoxy)phenyl]propane dianhydride (BPADA) had been synthesized and used for manufacturing adhesive free FCCL. The molecular weights of soluble aromatic imide oligomers were successfully controlled from 4000 to 10000 g/mol. BMIs dissolved in a polar organic solvent and cast onto a copper foil to form a 20txm coating, and heat-processed in hot air oven to form a polyimide layer on the copper foil. Thus, an adhesive free flexible copper clad laminate was obtained. The laminate has excellent heat resistance, thermal dimensional stability and low water-absorption.
出处 《化学与粘合》 CAS 2009年第3期4-7,18,共5页 Chemistry and Adhesion
关键词 热固型聚酰亚胺 马来酰亚胺封端 无胶型挠性覆铜板 Thermoset polyimide maleimide-terminated adhesives free FCCL
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