期刊文献+

利用热分析对导电胶进行组分分析的研究 被引量:1

Study on the Compositions of Conductive Paste by Thermal Analysis
原文传递
导出
摘要 为了分析一种导电胶的成分,利用热分析仪采用一次投样两次测试的方法,对导电胶进行DSC-TGA测试分析。通过对两次DSC-TGA测试曲线的分析、比对、计算及样品感观鉴别,排除有机物的干扰,半定量判定样品的化学成分及用量。得出此胶由无机物及有机物组成,其配比如下:二乙二醇甲醚约20%,乙基纤维素及其它未知有机物约1%,铝粉约40%,银粉约20%,低熔点玻璃粉及其它未知无机物约20%。此工作为利用热分析简便、快捷分析胶黏剂组分提供了一条新思路。 In order to analyze the compositions of a conductive paste, the sample was tested twice by the DSC-TGA thermal analysis in the thermal analysis instrument. The two DSC-TGA curves were analyzed, calculated and contrasted. The second DSC-TGA curves gave further information with the organic matter was burned down in the first test. The semi-quantitative compositions of the sample were got. It is found that the conductive paste contains organic and inorganic matter, and the approximate compositions are di-ethylene glycol mono-methyl ether is 20%, ethyl cellulose and other unknown organic matters are 1%, aluminum powder is 40%, silver powder is 20% and the glass powder and other unknown inorganic matters are 20%.
出处 《化学与粘合》 CAS 2009年第3期33-35,47,共4页 Chemistry and Adhesion
关键词 热分析 胶黏剂 组分 分析 Thermal analysis adhesive compositions analysis
  • 相关文献

参考文献3

  • 1梅特勒-托利多公司.热分析应用手册之聚合物的热分析[M].陆立明,唐远旺,蔡艺,译上海:东华大学出版社,2002:3-8.
  • 2罗世永,庞远燕,郝燕萍,陈强.电子浆料用有机载体的挥发性能[J].电子元件与材料,2006,25(8):49-51. 被引量:34
  • 3HUTCHINSON J M. Studying the glass trasition by DSC and TMDSC[J]. J. Term.Anal.Cal. ,2003, 72:619-629.

二级参考文献2

共引文献33

同被引文献6

引证文献1

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部