期刊文献+

掺杂PST薄膜的制备与介电调谐性能研究

Preparation and Dielectric Tunability of K Doped PST Ferroelectric Thin Film
下载PDF
导出
摘要 采用Sol-Gel法在Pt/TiO2/SiO2/Si衬底上制备了多种不同组分的(Pb0.3Sr0.7)1-xKxTiO3(PST)(x=0,1 mol%,2.5 mol%,5 mol%)多层均匀薄膜,并研究了它们的介电调谐性能。发现掺杂后薄膜的晶粒尺寸明显减小,介电常数降低及介电损耗减小。1MHz时,随K含量的从0增加至5mol%,薄膜的介电常数从841降低至539,而介电损耗由0.134减小到0.058,其微波介电综合性能改善。 (Pb0.3Sr0.7)1-xKxTiO3(PST)(x=0,1 mol % ,2.5mol%,5 mol %) uniform film of K do- ping on Pt/TiO2/SiO2/Si substrats were prepared by Sol--Gel process and their dielectric tunability were investigated. The results showed that the size of crystal are obviously diminished when K was doped into PST film,and the dielectric constant and the dielectric loss(tang)of film decreases. The dielectric constant decreased from 841 to 539 and and the dielectric loss(tanS)of film decreased from 0. 134 to 0. 058 at 1 MHz when K concentration increases from 0 to 5 mol %. Microwave dielectric comprehensive performance of PST film improved.
出处 《山东陶瓷》 CAS 2009年第2期17-20,共4页 Shandong Ceramics
关键词 钛酸锶铅 K掺杂 薄膜 SOL-GEL 介电调谐 Lead Strontium Titanate K Doping Film Sol-- Gel Dielectric Tunability
  • 相关文献

参考文献6

  • 1裴亚芳,杨传仁,陈宏伟,张继华,冷文健.钛酸锶铅铁电薄膜的制备、应用及其研究进展[J].绝缘材料,2006,39(6):23-27. 被引量:5
  • 2J. B. L. Rao, D. P. Patel. "Voltage Controlled Ferroelectrie --lens Phased Array", Dig. IEEE Antennas Propagate. Soc. Int. Sump, 1624-- 1627(1996)
  • 3M. W. Cole,P. C. Joshi,M. H. Ervin et al. ,"The influence of Mg doping on the materials properties of BaSrTiO thin films for tunable device applications", Thin Solid Films (J).. 374,34--41,(2000)
  • 4K.T. Kim,C. I. Kim,"Structure and dielectric properties of Bi-- doped Ba0.6Sr0.4TiO3 thin films fabricated by sol--gel method", Microelectronic Engi(J). 66,835--841 (2003)
  • 5M. Jain, S. B. Majumder, R. S. Katiyar,“Dielectric properties of sol -- gel -- derived MgO: Ba0.5 Sr0. 5 TiO3 thin -- film composites”. App. Phys(J). Lett. 81,No. 17,3212--3214 (2002)
  • 6王季魁,沈明荣,方亮,甘肇强.溶胶-凝胶法制备钛酸锶铅薄膜和多层膜及其介电性质[J].功能材料,2006,37(2):231-233. 被引量:4

二级参考文献32

  • 1Roelofs A, Schneller T, Szot K.et al.[J]. Nanotechnology.2003.14: 250.
  • 2Sheikholeslami A, Gulak P G. [J]. Proc IEEE. 2000,86:667.
  • 3Klee M, Mackeus U, Kiewitt R, et al.[J]. Philips J Res,1998,51:363.
  • 4Kingon A I, Streiffer S K, Basceri C,et al.[J], Summerfelt: Mater Res Bull,1996, 21: 46.
  • 5Jain M, Majumder S B, Guo R, et al.[J]. Materials Letters,2002, 56: 692.
  • 6Dibenedetto B, Cronan C J. [J]. J Am Ceram Soc,1968,51:364.
  • 7Chung H J, Chung S J, Kim J H,et al.[J]. Thin Solid Films,2001, 394: 213.
  • 8Kim K T, Kim C I. [J]. Thin Solid Films,2002, 420-421: 544.
  • 9Kang D H, Kim J H, et al. [J]. Mater Res Bull,2001,36:265.
  • 10Kim K T, Kim K I. [J]. Thin Solid Film,2002, 420-421:544.

共引文献5

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部