摘要
钎焊球是BGA及μBGA等高密封装技术中凸点制作关键材料。球化温度是影响钎焊球质量关键因素。本文采用切丝重熔法制作钎焊球,研究了球化温度对63Sn37Pb钎焊球真球度和外观质量的影响。结果表明:在一定球化温度范围内,钎焊球的真球度和表面质量均随着球化温度的升高而变好,但温度接近球化剂沸点时,真球度有所下降。
Solder ball is a key material of the bump fabrication in the BGA and μBGA high integrated package. The spheroidization temperature is the main factors to affect the quality of the solder ball. The solder ball was fabricated by the fine wire cutting-remelting method. The influence of spheroidization temperature on the real sphericity and the surface appearance of the solder ball were investigated. Theresults show that the real sphericity and surface appearance of the solder ball become better and better with the spheroidization temperature hoisting within the range of spheroidization temperature. But the real sphericity of the solder ball become smaller when the spheroidization temperature reaches the boiling point of the nodulizer.
出处
《热加工工艺》
CSCD
北大核心
2009年第9期8-10,共3页
Hot Working Technology
基金
河南省科技攻关项目(072102260016)
"十一五"国家科技支撑计划项目(2006BAF04B14)
