不同焊料对Cu/W钎焊接头强度的影响

Affect of Different Solder on Intension of Cu/W Brazing Joint

采用镍基焊料、铜基焊料、银基焊料、金基焊料对钨、铜进行真空钎焊实验,接头的剪切强度和扫描电镜分析表明,用银基焊料、金基焊料焊接钨、铜,焊缝扩散层薄,接头强度高,银基焊料中的活性元素钛对母材的浸润性好。

Experiments were made on tungsten and copper using nickel-based solder, copper-based solder,silver-based solder and gold-based solder, the shear strength of joint and analysis of scanning electron microscopy show that diffusion layers of weld are thin and the joint have a high strength when using silver-based solder and gold-based solder braze tungsten and copper. The active elements in silver-based solder have a better invasive on based metals.