摘要
采用镍基焊料、铜基焊料、银基焊料、金基焊料对钨、铜进行真空钎焊实验,接头的剪切强度和扫描电镜分析表明,用银基焊料、金基焊料焊接钨、铜,焊缝扩散层薄,接头强度高,银基焊料中的活性元素钛对母材的浸润性好。
Experiments were made on tungsten and copper using nickel-based solder, copper-based solder,silver-based solder and gold-based solder, the shear strength of joint and analysis of scanning electron microscopy show that diffusion layers of weld are thin and the joint have a high strength when using silver-based solder and gold-based solder braze tungsten and copper. The active elements in silver-based solder have a better invasive on based metals.
出处
《热加工工艺》
CSCD
北大核心
2009年第9期109-111,共3页
Hot Working Technology
关键词
钨
铜
真空钎焊
接头强度
镍基焊料
铜基焊料
银基焊料
金基焊料
tungsten
copper
vacuum brazing
joint strength
nickel-based solder
copper-based solder
silver-based solder
gold-based solder