摘要
综述了金及其合金的机械抛光、化学抛光和电化学抛光技术。介绍了金及其合金的氰化物型电解液,以及硫脲型、混合酸型和氯化物型电解液等无氰的电化学抛光工艺。指出了金及其合金抛光技术发展中存在的问题以及今后的发展趋势。
The mechanical polishing, chemical polishing and electropolishing of gold and its alloys were reviewed. Various electropolishing processes for gold and its alloys with cyanide and non-cyanide electrolytes including thiourea-type, mixed acid type and chloride type baths were introduced. The existing problems and development trends of polishing of gold and its alloys were presented.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2009年第5期27-30,34,共5页
Electroplating & Finishing
关键词
金及其合金
机械抛光
化学抛光
电化学抛光
gold and gold alloy
mechanical polishing
chemical polishing
electropolishing
