摘要
介绍了有机硅在环氧包封料、灌封料中的应用。借助于有机硅良好的低表面能、耐热、耐候、阻燃、憎水等性能来改善环氧包封、灌封料,解决其防潮、阻燃及耐冷热循环不佳的问题。实验表明,有机硅在改善产品性能方面应用前景广阔,是值得深入探索的领域。
The applications of silicone in epoxy encapsulating materials and potting compound were introduced in this review. Adding of silicone with properties like low surface energy, heat resistance, weathering resistance, flame retardance and hydrophobility in encapsulating material and potting compound can solve the problems of the materials in water repellency, flame retardance and thermal shock resistance. It was concluded that silicone is applicable to epoxy compounds and worth developing further.
出处
《绝缘材料》
CAS
北大核心
2009年第2期26-28,32,共4页
Insulating Materials
基金
天津市科技攻关计划资助项目(06YFGPGX07500)
关键词
有机硅
环氧树脂
包封料
灌封料
silicone
epoxy resin
encapsulating materials
potting compounds
