高温热处理对PI基炭薄膜的影响

THE EFFECT OF HEAT TREATMENT IN HIGH TEMPERATURE ON PI-BASED THIN CARBON FILM

研究了在氩气气氛的保护下，PI（聚酰亚胺）基炭薄膜在高温热处理过程中结构转变的过程和试样的若干性能与热处理温度的关系。用激光拉曼光谱和X—射线衍射技术对其样品的结构参数给予了表征。实验表明，在1700℃以前样品纵、横方向处于收缩状态，1700℃至3160℃（终温）则处于伸长状态；而重量变化却在2100℃以前处于减小状态，2100℃以后呈增重状态；电导率由1．03×102S／cm（1000℃）增加到2．1×104S／cm（3160℃）。随着热处理温度的提高．样品表面结构的有序度增加，终温样品十分接近石墨晶体；样品结构参数d002值逐渐减小，Lc值却一直处于增加状态。

The relation between some properties of the sample and the process of the structural conversion with heat treatment temperature for PI(polymide) -bsaed thin carbon film during the heat treatment in high temperature was studied under argon atmosphere. The structural parameters of sample were characterized by laser Raman spectroscopy and X-ray diffraction. The experimental results showed that both the longitudinal and transversal directions of sample were in shrinkage condition before 1700℃ and in elongate condition from 1700℃ to 3160℃; the weight change decreased before 2100℃ and increased after it; and the electrical conductivity rose from 1. 03×102S/cm(1000℃)to 2. 1×104S/cm(3160℃). With increasing the heat treatment temperature, the ordering degree of the surface structure of sample increases, and the sample of the final temperature was a more graphite-like crystal, While the d002 decreased gradually and Lc was in increasement condition all along.