摘要
以MEMS滤波器中的MEMS开关牺牲层的工艺为例,通过同时运用聚酰亚胺和正胶作为牺牲层材料的方法,避免了牺牲层单独使用聚酰亚胺做材料难于去除,或单独使用光刻胶做材料,叠层旋涂光刻胶时会出现龟裂的缺点。改善了牺牲层固化和刻蚀的效果,减小了刻蚀的时间。此研究应用在表面微细加工工艺中,对MEMS加工工艺具有一定的参考价值。
Research on sacrificial layer in MEMS switch of MEMS filter was presented. It＇s hard to remove by using only polyimide as the material of sacrificial layer. And using only laminated photoresist spin - coating would cause cracks. The polyimide and positive photoresist are both used for the sacrificial layer which can avoid the shortcomings of either using only polyimide or using only photoresist. This technology improved the cure and etching effect of sacrificial layer, and also greatly reduced etching time. This sacrificial technology has an important reference value to the application of the surface micro - machining technology.
出处
《电子工艺技术》
2009年第3期125-127,136,共4页
Electronics Process Technology
基金
国家自然科学基金项目(项目编号:60676047)
上海应用材料研究与发展基金项目资助(项目编号:06SA11)
上海重点学科建设项目资助(项目编号:B411)
关键词
射频微机械开关
牺牲层
聚酰亚胺
正胶
刻蚀
RF MEMS switch
Sacrificial layer
Polyimide
Positive photoresist
Etching
