摘要
球窝现象是密间距BGA、CSP类器件在无铅再流焊接中经常发生的一种高发性缺陷。在现场案例解剖、分析获取的数据和分析资料的基础上,根据其所表现的物理特征对球窝现象进行了分类。并基于密间距PBGA、CSP在再流焊接过程中所发生的物化现象,对其形成机理进行了研究和试验,在此基础上初步探讨了抑制此现象的对策。
Pillow -head effect is often discovered on fine pitch BGA/CSP in lead. free assembly process. Classify the effect based on physical character, study and experiment to find the cause of the formation of pillow - head effect, advise how to restrain the effect. All of these is based on the physical and chemical phenomena of fine pitch BGA/CSP assembly.
出处
《电子工艺技术》
2009年第3期137-140,143,共5页
Electronics Process Technology
关键词
BGA
CSP
球窝
BGA
CSP
Pillow - head effect
