摘要
微波数字复合基板是将微波电路与数字电路集合在一起的新型复合多层基板,其体积的缩小实现了雷达天线系统的轻量化和小型化。在复合基板的制作过程中,金属化孔的可靠性是保证天线电性能指标的关键。主要介绍了微波数字复合基板中微盲孔孔金属化及提高金属化孔可靠性的工艺方法。
Microwave digital composite substrate gets microwave circuits and digital circuits together into a new type of composite multi - layer substrates, which shrink the size and achieve lightweight and miniaturization of radar antenna systems. The hole metallization of the antenna is the key part to ensure the reliability of the electrical properties during processes of blind via micro - hole metallization composite substrates production. Mainly introduce the and improving the reliability of hole metallization of micro -wave digital composite substrate.
出处
《电子工艺技术》
2009年第3期144-146,161,共4页
Electronics Process Technology
关键词
微波数字复合基板
孔金属化
可靠性
Microwave digital composite substrates
Hole metallization
Reliability
