摘要
QFN器件体积小、质量轻,对返修温度敏感性大,其周边器件排布密集,容易因高温使可靠性受到影响,因此对于返修温度曲线提出了更高的要求,同时QFN器件的潮湿敏感性提出了对器件的烘烤需求,拆焊后焊盘残留物的清理要注意吸锡编带和烙铁头的选用等。对于上述问题给出了解决方案,对于QFN的返修工艺技术进行了全面的阐述。
QFN devices are mall,light, and sensitive to the rework temperature. Their peripheral devices are arranged intensively. The high temperature will affect its reliability, so the demand for rework temperatures profile is higher. At the same time, QFN needs to be baked for the moisture sensitivity before rework. After resoldering, the residue on the pad needs to be cleaned up, and need to pay attention to the selection of solder - wick and soldering iron tip finally. Give out the solutions for above - mentioned problems, and expound QFN rework technology.
出处
《电子工艺技术》
2009年第3期158-161,共4页
Electronics Process Technology
关键词
QFN
返修
温度曲线
模板开孔
QFN
Rework
Temperature profile
Stencil aperture
