非晶Cu-P钎料钎焊接头形成过程

Bonding process of pure copper with amorphous Cu-P interlayer

通过对非晶Cu-P钎料不同钎焊温度下钎焊接头的研究,分析了非晶钎料与普通晶态钎料在钎焊过程中的不同.结果表明,非晶钎料的钎焊过程由液相产生前的固相扩散阶段液相流动铺展阶段以及液相产生后的固相扩散阶段组成.由于非晶钎料中原子的扩散能力比晶态钎料强,所以非晶钎料的"前扩散阶段"(固相扩散阶段)过程较为充分;在钎料熔化阶段,非晶钎料生成的液相比例较晶态钎料少,钎焊时用于固相扩散阶段时间较长,因此表现出更多的扩散焊特性.

An amorphous Cu-P solder was prepared as interlayer for bonding of pure copper.The melting behavior of amorphous solder was investigated.The bonding process for pure copper with amorphous Cu-P interlayer was studied by many means.The results indicate that the bonding process is composed of pre-solid diffusion,spreading and solid diffusion.The amorphous alloy has a good diffusion capability,so the pre-solid diffusion period is performed enough. A little number of liquid metal diffusion happens on the surface of base metal.